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羅斌森

  • FES6J

  • Manufacturer : ON Semiconductor
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : *
    Part Status : Active
    Mounting Type : Surface Mount
    Package / Case : TO-277, 3-PowerDFN
    Supplier Device Package : TO-277-3

極速報(bào)價(jià)

型號(hào)
 品牌 封裝 批號(hào) 查看
2N4125TFR ON TO-92-3 New 詳細(xì)
H11D1 ON 6-DIP New 詳細(xì)
LM2576D2T-ADJR4G ON D2PAK-5 New 詳細(xì)
NSR10F20NXT5G ON 2-DSN (1.4x0.6) New 詳細(xì)
BC849BLT1 ON SOT-23-3 (TO-236) New 詳細(xì)
LA73076V-MPB-E ON 16-SSOP New 詳細(xì)
MC100EPT24DG ON 8-SOIC New 詳細(xì)
6N135S ON 8-SMD New 詳細(xì)
PN2484_D75Z ON TO-92-3 New 詳細(xì)
FQB5N60TM ON D2PAK (TO-263AB) New 詳細(xì)
BC373 ON TO-92-3 New 詳細(xì)
BSP51 ON SOT-223-4 New 詳細(xì)
BC856ALT3G ON SOT-23-3 (TO-236) New 詳細(xì)
FDMF6824B ON 40-PQFN (6x6) New 詳細(xì)
NRVHP120SFT3G ON SOD-123FL New 詳細(xì)
FDT86113LZ ON SOT-223-4 New 詳細(xì)
74LCX32244G ON 96-FBGA (13.5x5.5) New 詳細(xì)
NCP59152MNADJTYG ON 8-DFN (4x4) New 詳細(xì)
MM74HCT244WMX ON 20-SOIC New 詳細(xì)
LB11852RV-MPB-H ON 20-SSOPJ New 詳細(xì)