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  • XC7Z035-2FFG676E

  • Manufacturer : Xilinx Inc.
    Packaging : Tray
    Series : Zynq?-7000
    Part Status : Active
    Architecture : MCU, FPGA
    Core Processor : Dual ARM? Cortex?-A9 MPCore? with CoreSight?
    RAM Size : 256KB
    Peripherals : DMA
    Connectivity : CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    Speed : 800MHz
    Primary Attributes : Kintex?-7 FPGA, 275K Logic Cells
    Operating Temperature : 0°C ~ 100°C (TJ)
    Package / Case : 676-BBGA, FCBGA
    Supplier Device Package : 676-FCBGA (27x27)

極速報(bào)價(jià)

型號(hào)
 品牌 封裝 批號(hào) 查看
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XC9536-6VQ44C Xilinx 44-VQFP (10x10) New 詳細(xì)
XC17S100APD8C Xilinx 8-PDIP New 詳細(xì)
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XC17128ELPC20C Xilinx 20-PLCC (9x9) New 詳細(xì)
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XC4010XL-09PC84C Xilinx 84-PLCC (29.31x29.31) New 詳細(xì)
XC4VLX15-11FFG676I Xilinx 676-FCBGA (27x27) New 詳細(xì)
XC4013E-3PQ208I Xilinx 208-PQFP (28x28) New 詳細(xì)
XC2VP50-6FF1517I Xilinx 1517-FCBGA (40x40) New 詳細(xì)
XC4VFX60-11FF1152I Xilinx 1152-CFCBGA (35x35) New 詳細(xì)
XC7A200T-2FFG1156I Xilinx 1156-FCBGA (35x35) New 詳細(xì)
XC18V256SO20I Xilinx 20-SOIC New 詳細(xì)
XC17S10XLPD8C Xilinx 8-PDIP New 詳細(xì)
XC7A35T-1CSG324I Xilinx 324-CSPBGA (15x15) New 詳細(xì)
EFR-DI-OBSAI-WW Xilinx New 詳細(xì)
XC6SLX150T-4FGG676C Xilinx 676-FBGA (27x27) New 詳細(xì)
XC5VSX35T-2FFG665C Xilinx 665-FCBGA (27x27) New 詳細(xì)
XC2V6000-6FFG1152C Xilinx 1152-FCBGA (35x35) New 詳細(xì)