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產(chǎn)品系列

羅斌森
  • VSC8584XKS-08

  • Manufacturer : Microchip Technology
    Packaging : Tray
    Part Status : Active
    Mounting Type : Surface Mount
    Package / Case : 256-BGA
    Supplier Device Package : 256-BGA (17x17)

極速報(bào)價(jià)

型號(hào)
品牌 封裝 批號(hào) 查看
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24LC512-I/ST Microchip 8-TSSOP New 詳細(xì)
AR1021T-I/ML Microchip 20-QFN (4x4) New 詳細(xì)
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DSC400-2222Q0104KI2 Microchip New 詳細(xì)
MCP6293-E/MS Microchip 8-MSOP New 詳細(xì)
AT89C51CC01UA-RLTUM Microchip 44-VQFP (10x10) New 詳細(xì)
AT43USB380E-AC Microchip 100-LQFP (14x14) New 詳細(xì)
PIC18F26K80-E/MM Microchip 28-QFN-S (6x6) New 詳細(xì)
PIC32MK1024MCF064-E/PT Microchip 64-TQFP (10x10) New 詳細(xì)
PIC16LC54A-04I/SO Microchip 18-SOIC New 詳細(xì)
DSC8004CI2 Microchip New 詳細(xì)
PIC17C762T-16/PT Microchip 80-TQFP (12x12) New 詳細(xì)
AT89C51RB2-SLRIM Microchip 44-PLCC (16.6x16.6) New 詳細(xì)
DSC1121AM1-033.0000 Microchip New 詳細(xì)
PIC16C710T-04E/SS Microchip 20-SSOP New 詳細(xì)
DSC2311KI2-R0011 Microchip New 詳細(xì)