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羅斌森

  • MSP430FR5969IRGZR

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : MSP430? FRAM
    Part Status : Active
    Core Processor : CPUXV2
    Core Size : 16-Bit
    Speed : 16MHz
    Connectivity : I2C, IrDA, SCI, SPI, UART/USART
    Peripherals : Brown-out Detect/Reset, DMA, POR, PWM, WDT
    Number of I/O : 40
    Program Memory Size : 64KB (64K x 8)
    Program Memory Type : FRAM
    RAM Size : 2K x 8
    Voltage - Supply (Vcc/Vdd) : 1.8V ~ 3.6V
    Data Converters : A/D 16x12b
    Oscillator Type : Internal
    Operating Temperature : -40°C ~ 85°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 48-VFQFN Exposed Pad
    Supplier Device Package : 48-VQFN (7x7)

極速報(bào)價(jià)

型號(hào)
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SN74AHCT74QDRQ1 TI New 詳細(xì)
LM4040D30ILPRE3 TI New 詳細(xì)
SN74LVC2G132YEPR TI 8-DSBGA, 8-WCSP (1.9x0.9) New 詳細(xì)
TPS7B6925QDCYRQ1 TI SOT-223-4 New 詳細(xì)
TLC2274MDREP TI 14-SOIC New 詳細(xì)
ADC0820CCWM TI 20-SOIC New 詳細(xì)
TLC2578IDW TI 24-SOIC New 詳細(xì)
RC4558DRG3 TI 8-SOIC New 詳細(xì)
PT5062N TI New 詳細(xì)
TWL1103GQER TI 80-BGA MICROSTAR JUNIOR (5x5) New 詳細(xì)
LM3S601-EGZ50-C2 TI 48-VQFN (7x7) New 詳細(xì)
LM2940CSX-15/NOPB TI DDPAK/TO-263-3 New 詳細(xì)
LMV227SDX/NOPB TI 6-WSON (2.5x2.2) New 詳細(xì)
TPS61013EVM-157 TI New 詳細(xì)
SN75C3223EDWR TI 20-SOIC New 詳細(xì)
LP3856ESX-ADJ/NOPB TI DDPAK/TO-263-5 New 詳細(xì)
LM4899ITLX/NOPB TI 9-uSMD New 詳細(xì)